A non-uniform system such as microsegregation, heterogeneous microstructure and multiple-layer deposition of thin films, always exists in the engineering materials and the electronic materials for solid state devices. As a consequence of interdiffusion under high temperature exposure, The dynamical changes of composition profiles and vacancies could lead to materials in earlier failure and reduce the life time of the component. Several theoretical fundamentals have been proposed on different aspects, including(1) the void formation at the steepest concentration gradient:(2) thermodynamic view points of excess vacancy flux;(3) the model of interdiffusion for dynamic composition profile change; and(4) stress gradient induced strain enhanced diffusion, to systematically analyze the interdiffusion between layers in a laminate structure.
"Thermodynamic Aspect and Diffusion Model on Interdiffusion of Laminate Structure,"
Journal of Marine Science and Technology: Vol. 8:
2, Article 6.
Available at: https://jmstt.ntou.edu.tw/journal/vol8/iss2/6